•   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets
  •   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets
  •   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets
  •   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets
  •   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets
  •   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets
 0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets   0.39 inch OLED Micro display Integrated kit 640x400 resolution 500cd/m2 for AR VR headsets

Product Introduction



Product Description


The 0.39-inch OLED microdisplay integrated kit is a compact, high-performance visualization module designed primarily for electronic viewfinders (EVF).

The 0.39 inch OLED micro display integrated kit is a compact full-color solution tailored for AR and VR headsets, featuring a nominal 640×400 application format with a high-resolution 1024×768 microdisplay core. Equipped with an integrated CVBS board, the module supports multiple video inputs including RGB and YCbCr formats. With a typical luminance of 500 cd/m², a contrast ratio exceeding 10000:1, and a finely structured pixel array, it offers stable imaging performance and adaptable system integration within a miniature footprint.






General Specification

Parameter Specification                                                               
Model No.                                                                       HGM0XGA039136A
Display Size 0.39 inch
Resolution 1024 × 768 (supports 640 × 400 application)
Display Type Full Color OLED
Pixel Arrangement RGB Vertical Stripe
Pixel Pitch 7.5 μm
Active Area 7.92 × 6.00 mm
Structure Size 11.72 × 8.41 mm
Module Size (FPCA) 50.4 × 15.6 × 2.0 mm
Typical Luminance 500 cd/m²
Refresh Rate 60 Hz
Contrast Ratio >10000:1
Pixel Density 3255 PPI
Video Input RGB 24-bit / YCbCr 24-bit / YCbCr 16-bit
Additional Interface CVBS (Integrated)
Control Interface 2-wire serial
Operating Temperature -40°C to +65°C
Storage Temperature -55°C to +80°C




Display Structure and Imaging Performance

Microdisplay Architecture


The module is built around a silicon-based OLED microdisplay (Model: HGM0XGA039136A), utilizing a 1024×768 dot matrix arranged in an RGB vertical stripe. Although the panel supports XGA resolution, it is commonly configured for 640×400 display applications in AR/VR systems, balancing performance and signal compatibility.

With an active area of 7.92 × 6.00 mm and a diagonal size of 0.39 inches, the display achieves a pixel density of 3255 PPI. The ultra-fine pixel pitch of 7.5 μm contributes to smooth image rendering, which is essential for near-eye viewing environments.


Optical Characteristics


The display provides a typical luminance of 500 cd/m², suitable for controlled lighting conditions or systems with efficient optical paths. The contrast ratio exceeds 10000:1, ensuring clear differentiation between dark and bright regions.

Full-color capability is supported through precise grayscale management. An 8-bit input signal is internally processed via 10-bit digital-to-analog conversion, allowing improved gradation and consistent color transitions.






DRAWING



INTERFACE PIN FUNCTION




Signal Interface and Processing

Multi-Format Video Input


 

The integrated CVBS board enhances the module’s versatility by supporting both digital and analog video signals. The following input formats are available:

24-bit parallel RGB digital input

24-bit YCbCr digital input

16-bit YCbCr (4:2:2) format

CVBS (composite video signal) input

This combination enables straightforward interfacing with a wide range of processors and legacy video sources.



Digital Image Enhancement



The module integrates signal conditioning functions such as contrast adjustment and digital enhancement. Progressive scanning is employed to improve motion clarity and reduce visual artifacts, which is particularly beneficial in dynamic imaging scenarios.



Control Interface


A 2-wire serial interface is implemented for configuration and control. This allows efficient adjustment of display parameters, including brightness tuning and image orientation (horizontal and vertical mirroring), supporting flexible optical system design.


Mechanical Configuration and Reliability

Compact Module Design



The microdisplay die measures 11.72 × 8.41 mm, while the complete module with FPCA extends to 50.4 × 15.6 × 2.0 mm. This separation between display and interface circuitry allows greater flexibility in product integration, especially in space-constrained designs.



Environmental Adaptability

The module operates reliably across a temperature range of -40°C to +65°C, with storage capability down to -55°C and up to +80°C. This ensures stable performance in both consumer-grade and industrial environments.



Application Fields

AR/VR Near-Eye Systems


The compact size, high pixel density, and integrated CVBS interface make the module well-suited for augmented and virtual reality headsets, where space efficiency and image clarity are critical.



Portable Optical Equipment


The display can also be applied in digital viewfinders, inspection instruments, and wearable devices, where reliable performance and compact integration are essential.



Conclusion


The 0.39 inch Micro OLED display with CVBS integrated kit presents a well-balanced combination of resolution, interface flexibility, and compact design. Its stable optical performance and adaptable input options make it a practical choice for AR/VR systems and other precision display applications requiring miniature yet capable imaging solutions.

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Company: Hicenda Technology Co,.Limited.

Contact: Ashley Wu

Tel: +8617773983073

Phone: +8617773983073

E-mail: [email protected]

Address: A209 Room, 2nd Floor, Building A Huafeng International Robot Industrial Park, Gushu Xixiang street, Baoan District, Shenzhen city,518126, China

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